138 Degree Melting Low Temperature Solder Paste Sn42Bi58

Product Details138degree melting low temperature solder paste LF-05 Sn42Bi58Brief Description for LF-05 Sn42Bi58LF-05 Sn42Bi58 Pb-free tin bismuth solder paste is designed to enable low temperature surface mount assembly technology. The lead-free alloy in LF-05 Sn42Bi58 has a melting point 138°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from LF-05 Sn42Bi58 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards and get good reflowing soldering process result.Energy-saving by reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care.Usage of Sn42-Bi58 Solder Paste The Sn42Bi58 Bi series is designed to meet requirements for reliable solder joints in SMT PC board assemblies, this lead free no clean Bi solder paste can also apply for household-electrical products,which including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others.Exported countries:Pakistan,UAE,South Korea,America,Mid-east countries,Brazial,India,Iran,Egype,TurkeyGreater Print DefinitionMicroprint's small particle size of 5-45µm (-450+600 mesh), guarantees repeatable print definition to below 0.3mm for µBga workType3 solder paste25~45µmType4 solder paste22~38µmType5 solder paste15~25µmType6 solder paste10~18µmType7 solder paste5~12µmPacking Details:Packing could be classified as can/bottle packing and syringe packing type.Each jar/bottle holds the solder paste is 500g,50g;Each cartridge can load the solder paste is 100gThe packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.Customized logo:can be available when MOQ above 500kgProduction ability:2tons each weekStencil Life And Cleaning> 8 hours @ 30-45% RH and 20-25 oC~ 4 hours @ 45-75% RH and 20-25 oCCleaningBBIEN LF-05 low temperature tin bi solder paste Sn42Bi58 is no clean type of soldering paste, belongs to environmental friendly solder materials. Sn42Bi58can also be cleaned using commercially available flux residue removers such as cleaning flux ,which is available from BBIEN.Storage, Handling, and Shelf Life:Keep solder paste into refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,reflow characteristics, and overall performance.Sn42-Bi58 stencil and dispensing solder paste/cream should be stabilized at room temperature prior to printing. R520A should be kept at standard refrigeration temperatures, 3-8°C Please contact BBIEN if you require additional advice with regard to storage and handling of this material. Shelf life is general 6months from date of manufacture and held at 3-8°CPhotos of Sn42-Bi58 LF-05 no clean bi solder pasteTechnical DatasheetLF-05 Sn42Bi58 Solder Paste RoHS ComplianceThis product meets the requirements of the RoHS(Restriction of Hazardous Substances) Directive,2002/95/EC Article 4 for the stated bannedsubstances.BELLCORE AND J-STD TESTS & RESULTSBELLCORE AND J-STD TESTS & RESULTSTestResultTestResultJ-STD-004A (IPC-TM-650)J-STD-005 (IPC-TM-650)Flux Type (per J-STD-004A)ROL0Typical Solder Paste ViscosityMalcom (10rpm)1300 poiseFlux Induced Corrosion(Copper Mirror)Type LSlump TestPassPresence of HalideOxygen Bomb followed byion chromatography<50ppm Br -<50ppm Cl -Solder Ball TestPassTypical Tackiness35gWetting TestPassSIRPassBELLCORE GR-78SIRPassElectromigrationPassTechnical Data SheetSpecification and chemistry componentSpecificationSn42-Bi58AppearanceBlack Tacky pastePacking500g/jar;250g/jar;50g/jar;100g/cartridge tubeSn42-Bi58 Metal Chemical Composition:SortChemical composition (wt.%)SnBiAgPbFeCuAlCdSn42-Bi5842+/-158±1<0.0002<0.01<0.002<0.005<0.0002<0.002 Physical Speciality Sort (℃) Melting Pointg/cm3Spec. GravityMPa%Tensile StrengthSn42-Bi58138℃ 8.62g/cm338-48Reflowing Chart of Sn42-Bi58 Low Temperature Solder Paste Heating rateThe Time Required to 120 ºCConstant Temperature80 - 130ºCPeak Temperature> 180°CCooling Rate1-3 ºC/sec< 60—90secs60—120secs< 170 ±5ºC< 40—80secs<4ºC / S Recommended reflow process parameters Using Note:1. Open the package using the solder paste is necessary before fully warmed to room temperature (recommended for 4 hours); return temperature for 48 hours in the retention period, after opening a period of 12 hours, stay in the solder paste reflow PCB board to have pre- idle time is 100 ± 20 minutes.2. Cold storage may cause the separation of components within the solder paste, solder paste is stirred well before use 3 to 5 minutes to re-mix. (Recommended: automatically stir 3 ± 0.5 minutes, hand-mixing 5 ± 1 minute, mixer speed: revolution 400rpm, rotation 100rpm).3. Do not use the leftover paste paste mixed with the new packaging in the same bottle. Without the use of solder paste should be re-sealed, when the cap can not be sealed very well replace the cap when the sealing liner to ensure that as much as possible.FeatureBBIEN LF-05 Sn42-Bi58 Pb-free no clean solder paste has following advantage feature:1) Reduces thermal damage to components and substrateEnergy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.2) High insulation reliabilityThe flux solvent volatilizes even in low temperature reflow, eliminating reduction in insulation resistance arising from inadequate volatilization. TB48-M742・T4AB48/58-M742 produces flux residue with high insulation reliability.3) Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used.4) Reduces energy consumption in reflow ovens versus standard lead free alloys.5) Reduces reflow process cycle time.6) Delivers 8 Hour stencil life.7) Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering.8) Compatible with all commonly used lead free surface finishes (Entek HT; Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)Advantage And ServiceBBIEN LF-05 Sn42-Bi58 Low Temperature Solder paste Products AdvantageDue to sophisticated technical in Sn-Bi alloy,BBIEN can supply the thinnest size of type7(5~12micron) for LF-05 Sn42-Bi58 Pb-free tin Bi soldering paste, normal size such as type6,type5,type4 and type3 are also availableLF-05 Sn42-Bi58 138 degree Celsius melting point no clean solder paste can be not only applied to tradional electronics pcb,smt reflowing soldering,but also its application for some new hi-tech industry, semiconductor. LED,aerospace,automotive.BBIEN solder paste factory have skilled technical to make solder whci can be applied for many different kinds of electronics,SMT,SMD,PCB..BBIEN is specialized in soldering industry from 2000, known as a experienced solder paste manufacturer, whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for lead free solder paste industry,until now,we accumulate much valuable experience,six senior solder paste engineers operate a specialized reflowing solder paste production.middle temperature no clean solder paste LF-05 Sn42-Bi58 offers high solderbility,wettibility and reliability, it is available in a wide product lineup according to the required soldering temperature.LF-05 Sn42-Bi58 low temperature 138 degree Celsius solder paste can be packaged with jar 50,500g,which is used for stencil soldering; it can also be packed with 100g jet tube used for dispensing soldering.Shipping AdvantageMutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety ,quickly and efficiently.Shipment can be deliveried once placing order 2 to 10 working days.Shipment will be regular go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.Technique AdvantageBoth pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully, quickly, technical support is available.We are tyring to make our product quality system more and more complete, BBIEN also appreciate your precious suggestion. BBIEN can share the datasheet for our product to our clients.Certificate of compliance,SGS,ISO and COA,MSDS,are available.ServiceWhen you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours. And solve your problem on solder products.OEM is available according to your own logo.Payment way:A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.Return back to societyBBIEN also participates public benefit activities,return back to society.We support and want to create a environmental friendly society together with people.We also try our best to help someone who need us.