Sn99Ag0.3Cu0.7 High Melting Solder Powder

Product DetailsBBIEN LF-06 Sn99Ag0.3Cu0.7 high melting solder powderBrief Introduction for Sn99Ag0.3Cu0.7 powderBBIEN is providing low oxygen content tin-silver-copper solder powder with atomization machine.LF-06 Sn99Ag0. 3Cu0.7 high temperature solder powder is the lower cost and high quality among Sn-Ag-Cu series alloy powder.Production methodOur solder powder line include atomizer,storage pot,feeding and sieving machine.We are using centrifugal technology for powder production.It can produce a wide product range such as type 3,type 4 and type 5 powder with good roundness and low oxygen content.The daily output is around 2 tons,atomizing yield can reach to 70%,product yield is 40%.Our solder powder quality can achieve International Standard J-STD-006.The feeder adopts electro-magnetic vibration with two kinds of control system for your option,manual mode and loss-weight mode.Both of them are easy to operate.Loss-weight system mode can accurately control the feed rate evenly and automatically.Advanced powder classification and collection technology enables Type 3-Type 4 alloy soldering powder free of powder smaller than 20um.Particle size distribution of products released by this enterpri Raw material review,synchronous sampling,periodic submission of samples to authorities sampling inspetion,advanced chemical and particle size testingapparatuses,timely follow-up and feedback of product information constitute ourcomplete quality supervision system that guarantees the quality of our products.Mix size below 1%Above 90%contentMax size below 5%Type610um10-18um18umType75um5-12um12umType345um25-45um20umType438um20-38um20umType525um15-25um15umSpecificationSn99-Ag0.3-Cu0.7 type4 and type3 solder powderAppearanceGray/black small size of powder on surfacePackingGeneral 1kg/bag and 5kg/bag foil bag with nitrogen packed-inChemistry componentElements Specification(%)MaxTested result(%WT)Sn96.5±199.599.1Ag0.3±0.10.27Al0.0050.0002As0.0300.0050Sb0.0500.0148BiRemainderRemainderCu0.6~0.80.7Fe0.0100.0003In0.0500.0019Ni0.0100.0007Pb0.0500.0257Cd0.0020.0002Au0.0500.0010Mark:The above concentration of specification are in%weight.Single value listed are the maximum allowable standard.c.Size:5-45micro-50%average size:smaller than 10 micro-Oxygen content:less than 200ppmPurity and chemistry component of Sn-Ag-CuSortMelting PointSpec.Gravity g/cm3MPaTensile StrengthSn99Ag0.3Cu0.7227℃7.48g/cm365.5Alloy componentMeltingpoint℃SuggestingWorking temperature℃Gravity g/cm3Rigidity HBConduct heatM.S.KExtendMpaExtendrate%Conductivity%Sn99Ag0.3Cu0.7227150-3507.58166460-80Above7016.4