Mid Temperature Solder Paste Sn62Pb36Ag2

Product DetailsMiddle and low temperature lead solder paste BBIEN TL-02 Sn62Pb36Ag2Brief IntroductionBBIEN solder paste manufacturer has enough technique to make tin-lead-silver Sn62Pb36Ag2 solder paste,Website:http://www.bbiensolder.com,which is an organic acid,water-soluble solder paste that provides users with the highest level of consistency and performance.Batch after batch,Sn62Pb36Ag2 provides hours of stable stencil life,tack time and repeatable brick defini-tion.Sn62Pb36Ag2’s robust printing characteristics result in consistent solder paste volume regardless of idle time,stencil life and print speed.The activator package in the Sn62Pb36Ag2 is very aggressive and provides superior wetting to OSP-coated PCB’s and Ag/Pd components.Sn62Pb36Ag2 Solder paste Melting informationSn62Pb36Ag2 has a melting point about 179°C to 183 degree,and has been successfully used with peak reflow profiles between 155°C and 190°C.Contained 2%silver,which make soldering point is brighter and very good soldering result.The outstanding batch consistency,anti-slump chemistry,consistent print volumes,solderability and cleanability make the Sn62Pb36Ag2 an ideal water-soluble solder paste for any application.Stable wetting behavior over a wide range of profilesAvailable type size of Sn62Pb36Ag2 solder pasteBBIEN supplies five types of solder paste for TL-02 Sn62Pb36Ag2 Pb no clean pasteType7(5~12micron)lead solder paste for ultrafine pitch printing technique.Type6(10~18micron)Sn-Pb-Ag solder paste/creamType5(15~25micron)no clean solder paste for leaded-SMD solderingType4(25~38micron)normal type of leaded solder paste for normal stencil and dispensing soldering.Type3(25~45)tin lean solder pasteAvailable packing infosmationThe Sn62Pb36Ag2 medium temperature lead solder paste could be classified as can/bottle packing and syringe packing type.Each jar/can/bottle holds the solder paste/cream is 500g;Each cartridge/syringe can load the solder paste/cream is 100gThe packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.Carton size:34.5*27.5*587.5px,10kgFeature of BBIEN TL-02 Sn62Pb36Ag2 solder pasteThe product offers the following advantages:
Exceptional print to print consistency
Suitable for fine pitch down to 0,4mm
Compatible with a wide range of solderable surfaces
Effective over a wide range of reflow profiles in air or nitrogen
Overall wide process window in print and reflow
High tackiness for high speed pick and place equipment
Temperature range for application 20-32°CApplicationBBIEN TL-02 Sn62Pb36Ag2 lead solder pastes was developed for stencil printing.In combination with the alloy Sn62Pb36Ag2 in solder particle size type 3(25-45µm)it can be used on every open stencil printing system.Typical application parameters:0.4-0.65mm Pitch at 150µm stencil thickness.Typical application parameters:0.4-0.65mm Pitch at 150µm stencil thickness;TL-02 Sn62Pb36Ag2 lead solder pastes are used in the assembly of printed circuit boards(PCBs)and SMT for a wide variety of applications,including hand-held electronic devices such as smart phones and tablets,computer motherboards,consumer electronic products,network servers,automotive systems,medical and military equipment and many others.Recommendation for solder paste printing1. Use always the thinnest possible stencil thickness.2. Use always stencils with rounded corners,to reduce clogging of apertures to the lowest possible minimum.
3. Set the squeegee pressure to 1kg for each 125px of squeegee length.Then reduce the pressure step by step,till the solder paste starts smearing on the stencil.Then add 1kg to the squeegee pressure and check,that the solder paste leaves no residues after printing on the surface of the stencil.Evaluate this parameter at your desired print speed.
4. Optimum print results can be achieved at print speeds between 10-75 mm sec-1.5. Please ensure a perfect sealing between PCB and stencil.The PCB has to have the best possible support,to achieve the optimum sealing to the stencil,so that the solder paste cannot be printed between pads and stencil.This avoids solder balling.6. Printer down times up to 30min can be achieved.The following first print after 1h should give good filling of apertures and a good print result.Open times of the PCB between print and reflow up to 24h can be realised by storing the printed PCB in a closed container to prevent the solvents from evaporating.Storage,Handling,and Shelf Life:Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,reflow characteristics and overall performance.HM531 should be stabilized at room temperature prior to printing.HM531 should be kept at standard refrigeration conditions,3-10°C Please contact BBIEN,if you require additional advice with regard storage and handling of this material.Shelf life is 6 months from date of manufacture when handled properly and held at 3-10°C.Payment terms:T/T,Western Union or Paypal,L/C could be discussedShipping way:DHL,EMS,TNT,airway shipping,seaway acceptableExported countiesRussia,UAE,Saudi-Ara,Iran,Egype,Turkey,Columbia,Eastern European countriesTechnical DatasheetMiddle and low temperature lead solder paste BBIEN TL-02 Sn62Pb36Ag2Sn62Pb36Ag2 Solder Paste Reflow ProfileThe reflow can be done either in air or nitrogen.Following is an example for a temperature profile for the solder paste TL-02 Sn62Pb36Ag2,which has shown good reflow results in practice with best wetting.Depending on the soldering equipment and PCBs,different temperature profiles may be used.This temperature profile can only be a recommendation.Our recommendation for this solder paste is to use a linear profile,as this will ensure the optimum activity of the solder paste and ensures perfect wetting.If a non-linear(soak)profile has to be used for some reasons,the temperature in the preheat area should not exceed 120sec.at max.160°C. Physical Properties and DataSolder powder:The solder powder for BBIEN TL-02 Sn62Pb36Ag2 solder pastes is produced by atomising alloys conforming to the purity requirements of J-STD-006,EN 29453 or other national and international standards where relevant.Careful control of production processes ensures exact solder powder particle distribution in a spherical shape.GENERAL PROPERTIESBBIEN TL-02Alloy:Sn62/Pb36/Ag2Melting Point Range(°C)179Metal content90%Solder powder10%Mixture fluxSolder powderType3(25-45µm);Type4(25-38µm);Type5(15-25µm);Type6(10-18µm);Type7(5-12µm);ApplicationStencil printingDispensing printingViscosity Brookfield cPs(1),25°C650.000-850.000TESTS SPECIFICATION RESULTSPECIFICATIONRESULTCopper mirror corrosion:IPC-SF-818/ANSI J-STD-004Pass,type LSurface insulation resistance (without cleaning):IPC-SF818PassANSI J-STD-004-IPC-TM650PassElectro migration:IPC-SF-818/ANSI J-STD-004PassSolder balling:After 1h@RTPass,class1After 24@RTPass,class1Tackiness:JIS-Z-3284At least 100g after 24hFlux Activity Classification(without cleaning):DIN 29454-11.1.2.CANSI J-STD-004(IPC-SF-818)L1Metal compositionSpecificationSn62Pb36Ag2 solder pasteAppearanceBlack tacky past appearanceWeigh500g/jar,100g/syringe;10kg/ctnSortChemical composition(wt.%)SnPbAgCuBiZnSbFeAlAsCdSn62-Pb36-Ag262±0.536±0.520±0.20.08<0.10.03<0.03<0.02<0.005<0.003<0.002Advantage And Service179 degree no clean lead solder paste BBIEN TL-02Sn62Pb36Ag2Product Advantage1) Microprint's small particle size of 5-45µm (-450+600 mesh), guarantees repeatable print definition to below 0.3mm for µBga work2) TL-02 Sn62Pb36Ag2 solder paste have following typesApplication CharacteristicsIPC ALLOY POWDER TYPEAlloy powder sizeAlloy powder contentMixture fluxStandard Printing3 25~45 μm89 %10~11%Fine pitch printing420~38 μm 88.5 %10~11%Fine pitch printing5 15~25 μm89 %10~11%Ultrafine pitch printing610~18μm90%10%Ultrafine pitch printing75-12μm85-90%10~15%BBIEN is specialized in soldering industry from 2000, known as a experienced solder paste,syring tin lead solder paste,SMT solder paste manufacturer,whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for lead free solder paste industry,until now,we accumulate much valuable experience,six senior solder paste engineers operate a specialized reflowing solder paste production.middle temperature no clean solder paste TL-02 BBIEN Sn62Pb36Ag2 offers excellent solderbility,wettibility and reliability amont leaded Pb contained solder paste, it is available in a wide product lineup according to the required soldering temperature.Due to sophisticated technical in Sn-Pb alloy,BBIEN can supply the thinnest size of type7(5~12micron) for TL-02 BBIEN Sn62Pb36Ag2 no clean solder paste, normal size such as type6,type5,type4 and type3 are also availableTL-02 BBIEN Sn62Pb36Ag2 silver no clean solder paste can be not only applied to tradional electronics pcb,smt reflowing soldering,but also its application for some new hi-tech industry, semiconductor.LED,aerospace,automotive.TL-02 BBIEN Sn62Pb36Ag2 middle temperature 179 degree Celsius low temperature solder paste can be packaged with jar 50,500g,which is used for stencil soldering;it can also be packed with 100g jet tube used for  dispensing soldering.Shipping AdvantageMutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety ,quickly and efficiently.Shipment can be deliveried once placing order 2 to 10 working days.Shipment will be regular go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.Technical AdvantageBBIEN can share the datasheet for our product to our clients.Certificate of compliance,SGS,ISO and COA,MSDS,are available.We are tyring to make our product quality system more and more complete, BBIEN also appreciate your precious suggestion. Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully,quickly,technical support is available.ServiceWhen you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours. And solve your problem on solder products.OEM is available according to your own logo.Return back to societyBBIEN also participates public benefit activities,return back to society.We support and want to create a environmental friendly society together with people.We also try our best to help someone who need us.Payment way:A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.